JPH0432782Y2 - - Google Patents

Info

Publication number
JPH0432782Y2
JPH0432782Y2 JP1986127797U JP12779786U JPH0432782Y2 JP H0432782 Y2 JPH0432782 Y2 JP H0432782Y2 JP 1986127797 U JP1986127797 U JP 1986127797U JP 12779786 U JP12779786 U JP 12779786U JP H0432782 Y2 JPH0432782 Y2 JP H0432782Y2
Authority
JP
Japan
Prior art keywords
resist
film
layer
resist layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986127797U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6336074U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986127797U priority Critical patent/JPH0432782Y2/ja
Priority to KR2019870004899U priority patent/KR900004078Y1/ko
Publication of JPS6336074U publication Critical patent/JPS6336074U/ja
Application granted granted Critical
Publication of JPH0432782Y2 publication Critical patent/JPH0432782Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP1986127797U 1986-08-23 1986-08-23 Expired JPH0432782Y2 (en])

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1986127797U JPH0432782Y2 (en]) 1986-08-23 1986-08-23
KR2019870004899U KR900004078Y1 (ko) 1986-08-23 1987-04-09 플렉시블한 인쇄 배선기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986127797U JPH0432782Y2 (en]) 1986-08-23 1986-08-23

Publications (2)

Publication Number Publication Date
JPS6336074U JPS6336074U (en]) 1988-03-08
JPH0432782Y2 true JPH0432782Y2 (en]) 1992-08-06

Family

ID=31022893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986127797U Expired JPH0432782Y2 (en]) 1986-08-23 1986-08-23

Country Status (2)

Country Link
JP (1) JPH0432782Y2 (en])
KR (1) KR900004078Y1 (en])

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5423259U (en]) * 1977-07-19 1979-02-15
JPS58116269U (ja) * 1982-01-30 1983-08-08 日本メクトロン株式会社 可撓性回路基板

Also Published As

Publication number Publication date
KR900004078Y1 (ko) 1990-05-08
KR880005587U (ko) 1988-05-12
JPS6336074U (en]) 1988-03-08

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